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QIANLI iBlack 3D BGA Stencil A7 A8 A9 A10 A11 CPU RAM For iPhone 5S 6G 6Plus 6S 6SP 7 7P 8 8P Layer Reball IC Steel Mesh Tin Net option:A9 CPU RAM 3D Power: 250W

QIANLI iBlack 3D BGA Stencil A7 A8 A9 A10 A11 CPU RAM For iPhone 5S 6G 6Plus 6S 6SP 7 7P 8 8P Layer Reball IC Steel Mesh Tin Net option:A9 CPU RAM 3D Power: 250W

Name: QIANLI iBlack 3D BGA Stencil A7 A8 A9 A10 A11 CPU RAM For iPhone 5S 6G 6Plus 6S 6SP 7 7P 8 8P Layer Reball IC Steel Mesh Tin Net option:A9 CPU RAM 3D Power: 250W
Brand: matisco.be
SKU: 67628345992
Price: 11.81 USD
Availability: InStock
Rating: 4.1602 (29 reviews)

SKU: 67628345992

4.2

DKK11.81 DKK40.81

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Ships within 48 hours · Estimated delivery Aug 6 - Aug 11

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QIANLI iBlack 3D BGA Stencil A7 A8 A9 A10 A11 CPU RAM For iPhone 5S 6G 6Plus 6S 6SP 7 7P 8 8P Layer Reball IC Steel Mesh Tin Net option:A9 CPU RAM 3D Power: 250WPRODUCT INTRODUCTION Place of Origin: Guangdong, China(Mainland) Brand Name: QianLi Model Number: 3D Android Black Stencil MSM 8937 2AA Material: Aluminum PRODUCT FEATURES Description: Quanli 3D Android Black Stencil MSM 8937 2AAQualcomm Snapdragon Function: Reballing IC pins

Store: matisco.be · Domain: matisco.be

Description

Power: 250W

This is a brand new high quality Samsung Galaxy S9 Middle Frame Black

It is professionally used for tin planting of iPhone series mobile phone chips such as A8 A9 A10 A11 A12 A13 A14 A14S

This is a brand new high quality Samsung Galaxy S9 Plus Charging Port Flex Cable

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