RMA-042 T3-T6 - Sn42Bi58 low-temperature no-clean eutectic rosin mildly active solder paste (ROL0) F Utilizing the Sn10Pb88Ag2 alloy (2%

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RMA-042 T3-T6 - Sn42Bi58 low-temperature no-clean eutectic rosin mildly active solder paste (ROL0) F Utilizing the Sn10Pb88Ag2 alloy (2%Low temp solder paste for electronics assembly using rosin mildly activated LT solder flux Used for attachment of temperature sensitive components to printed circuit boards, step soldering, warpage prevention, flexible circuits and large area array devices. Delivers reliable solder connections with low temperature reflow. Solders low Tg flexible boards and circuits used in phones, wearables and IoT devices Low temp BGA paste reduces HIP (head in

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